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C2012X5R1C226M125AC 0805 226M 16V


C2012X5R1C226M125AC 0805 226M 16V X5R 20%

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C2012X5R1C226M125AC 0805 226M 16V
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C2012X5R1C226M125AC 0805 226M 16V
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C2012X5R1C226M125AC




交貨型號(hào)  ?
C2012X5R1C226MT****
用途
一般等級(jí)一般等級(jí)
特點(diǎn)
General一般 (~75V)
系列
C2012 [EIA 0805]
狀態(tài)
量產(chǎn)體制量產(chǎn)體制
品牌
TDK
  • MLCC,積層貼片陶瓷片式電容器:C2012

  1. 1
  2. 2

圖片僅供參考,并展示示范產(chǎn)品。

尺寸

長(zhǎng)度(L)
2.00mm ±0.20mm
寬度(W)
1.25mm ±0.20mm
厚度(T)
1.25mm ±0.20mm
端子寬度(B)
0.20mm Min.
端子間隔(G)
0.50mm Min.
推薦焊盤(pán)布局(PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
推薦焊盤(pán)布局(PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
推薦焊盤(pán)布局(PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

電氣特性

電容
22μF ±20%
額定電壓
16VDC
溫度特性  ?
X5R(±15%)
耗散因數(shù) (Max.)
10%
絕緣電阻 (Min.)
4MΩ

其他

溫度范圍
-55~85°C
焊接方法
流體
回流
AEC-Q200
NO
包裝形式
塑封編帶 (180mm卷筒)
包裝個(gè)數(shù)
2000pcs

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